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Create Project
Project Properties
Project Name:
Project Type:
Processing
Storage
Input
Output
Network
Data Storage
Security
Industrial Automation
IoT (Internet of Things)
Prototyping
Wearable
Robotics and Automation
Embedded Systems and Electronics
Audio and Video
Parallel Computing
Tecnology:
SMD
Through-Hole
Substrate:
IMS
FR4
FPC
Finishing:
OSP
HASL
ENIG
ENEPIG
TIN
SIL
HEG
Via Material:
Epoxy
Copper
Nickel
Gold
Silver
No Filled
No Vias
Th. Via Material:
Epoxy
Copper
Nickel
Gold
Silver
No Filled
No Vias
Holes Plate:
Copper
Nickel
Gold
Silver
No Plated
Comp. Sides:
Side A
Side B
Both
Electronic Properties
Operating Voltage (V):
Maximum Current (A):
Maximum Power (W):
Maximum Temperature (°C):
Resistance (Ohms):
Operating Frequency (Hz):
Capacitance (F):
Impedance (Ohms):
Inductance (H):
Efficiency (%):
Duty Cycle (%):
Ripple Voltage (mV):
Design Rules
Min. tracks clearance:
Min. track width:
Min. track angle:
Min. connection width:
Min. annular width:
Min. via diameter:
Copper to hole:
Copper to edge:
Min. through hole:
Min. hole to hole:
Min. uVia hole:
Silkscreen clearance:
Min. Silkscreen text:
Max. allowed deviation %:
Max. thermal deviation %:
Plate thickness:
Layers
Add Layers
Order
Name
Material
Thickness (mm)
Thermal
Density
Resistance
Dielectric
Conductivity
Acciones
Define PCB Profile
Click or Drop your .dxf file here!
Components
Select Component:
Side:
Side A
Side B
Add Component
Ref
Value
Pins
Part
Type
Reference
Side
Acciones
Define Net List
Click or Drop your .net file here. Only KiCad files supported at the moment!
Code
Name
Pin Pairs
Acciones